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2026-10-28 CST 4

Thermal Resistance Interpretation of Power Semiconductors and Thermal Design Guidelines

Thermal Resistance Interpretation of Power Semiconductors and Thermal Design GuidelinesThermal resistance is a core parameter for evaluating power semiconductor heat dissipation performance. It describes the temperature rise generated per unit power c…

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2026-10-28 CST 5

Crosstalk Analysis of High-Speed Signal Lines and PCB Routing Optimization

Crosstalk Analysis of High-Speed Signal Lines and PCB Routing OptimizationCrosstalk is a ubiquitous coupling interference phenomenon on PCBs. It arises from mutual capacitance and mutual inductance between adjacent traces. In high-speed sampling, comm…

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2026-10-28 CST 4

Analysis of Bootstrap Circuit Risks and Design Considerations for Half-Bridge Topologies

Analysis of Bootstrap Circuit Risks and Design Considerations for Half-Bridge TopologiesThe bootstrap circuit is the most common drive power supply scheme for high-side MOSFETs in half-bridge, full-bridge and synchronous buck converters. It generates …

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